Meric Technology partners page

Custom ASICs and Modules - System Integration

Meric Technology and HMT microelectronic offer state of the art mixed signal ASIC and module solutions in partnership with leading foundries and leading module assembly companies. Our system expertise and design capabilities allow us to design and produce products that meet challenging requirements. We would be proud to have you as a customer and be your long term partner.

Product Offering
Design and production of ASICs in various technologies (low volt up to 120V) Design and production of microelectronic modules, sub-systems and systems High density packaging based on Chip on Board, Flip-Chip, in-Chip, in-house Bumping Technologies Various substrate as Hybrid, PCB, Film, Flex, Glass and Metal
ASIC Solutions	ASIC Technologies
Low power, low voltage ASIC down to 0.9V High power, high voltage design up to 120V High temperature SOI technologies (qualified at 200°C and under qualification >225°C) Analog and mixed signal design CMOS, BiCMOS, BCD technologies Low quantity to high quantity Analog digital CMOS Array to Full Custom	Deep submicron technologies (CMOS, BiCMOS, BCD), high volume products, 6 and 8 inch wafers CMOS and BCD technologies, high voltage applications (up to 100V), 6 inch wafers SOI Technologies, high voltage applications (up to 120V), high temperature applications (up to 200°C, including E2PROM), 6 inch wafers Analog / digital mixed CMOS technologies 0.35µmwith E2PROM, up to 12V, high density (up to 20kGates/mm2), low voltage, low consumption CMOS technologies (bulk or SOI) with E2PROM, up to 40V, piezo resistance layer, high temperature (up to 200°C) and high reliability applications
Module Solutions	Module Technologies
High density packaging, Chip on Board, Flip-Chip and Bumping technologies... …everything that has to be small and beautiful, requesting special high technology knowledge and capabilities High quality system level production: SMD, through hole components, cabling and deep in-line testing... …everything that can be produced with standard equipment, needing deep testing and high quality production knowledge and capabilities, repair and after sales services	Wire Bonding technologies Flip-Chip technologies Bumping Technologies SMD technologies Hybrid technologies PCB technologies Film technologies Glass technologies Insulated metal substrate technologies
Core Competences
ASICs for Motor drive and control: We develop ASICs to power and control electric motors, with a specialty in DC brushless sensorless devices. Mounting inside the motor is supported with silicon designs for high temperatures and voltages. More details (pdf version)
ASICs for Sensors: Precision analog circuitry and right technologies for communications together with integrated voltage supplies are the basis of cost saving sensor solutions. More details (pdf version)
ASICs for Actuators: Robust piezoceramic and inductor drive stages, closely linked with switched mode power schemes and intelligent control provide strong advantages in actuator control. More details (pdf version)
ASICs for Telemetry and Medical with RFID: Miniature device packaging and low power electronics enable the manufacture of all sorts of medical sensors and actuators with remote powering and bidirectional communication More details (pdf version)